Defected and floating ground structures for vertical interconnects

Publikationstyp
Conference Paper
Date Issued
2009-10
Sprache
English
Author(s)
Stark, Alexander  
Olbert, H.  
Jacob, Arne F.  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/8461
Start Page
153
End Page
156
Article Number
5296401
Citation
European Microwave Conference (EuMW 2009)
Contribution to Conference
39th European Microwave Conference, EuMW 2009  
Publisher DOI
10.1109/EUMC.2009.5296401
Scopus ID
2-s2.0-72949101583
Defected and floating ground structures for vertical interconnects are investigated up to the E-band. For quasi symmetrical microstrip-to-microstrip (MS-to-MS) transitions the effect of shape and size of ground plane cutouts is studied. In addition, floating ground pads are proposed to enhance the matching of asymmetrical microstrip-to-stripline (MS-to-SL) transitions. All examined interconnects are quite insensitive to the influence of the environment and can thus be used in densely packed multilayer applications. The agreement between simulation and measurements confirms the concepts.