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A Large deflection model of silicon membranes for testing intrinsic stress of MEMS microphones by measuring pull-in voltage
Publikationstyp
Conference Paper
Date Issued
2013-08-12
Sprache
English
TORE-URI
Volume
8763
Article Number
876326
Citation
The International Society for Optical Engineering (8763): 876326 (2013-08-12)
Contribution to Conference
Publisher DOI
Publisher
SPIE
ISBN
978-0-8194-9560-0
Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend on the manufacturing process. As a result, deviations during this process can result in sensitivity variations of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected at an early stage within the manufacturing process instead of determination at a system functionality test after packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying tensile stress due to manufacturing tolerance is evaluated.
Subjects
Circular diaphragm
Inertial tensile stress
Large deflection
MEMS
Pull-in
Silicon microphone
Test
DDC Class
600: Technology