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Simulation: A case for interoperability based on LCIM—The μGrip approach
Publikationstyp
Conference Paper
Date Issued
2017
Sprache
English
TORE-URI
Number in series
IEEE 15th International Conference on Industrial Informatics (INDIN 2017)
Start Page
492
End Page
497
Citation
IEEE 15th International Conference on Industrial Informatics (INDIN 2017)
Contribution to Conference
Publisher DOI
In this contribution, we outline the need for a structured modeling approach based on international standards to drive forth a case study for integrating DER into a micro grid. While this μGrip project also addresses market aspects, we outline the need for a structured way to model interfaces to fit for simulation, our approach taken, and an extension to the current practice of M/490 SGAM-based modeling.