Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
IEEE Workshop on Signal and Power Integrity, SPI: 7237387 (2015-09-02)
Contribution to Conference
A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.
cylindrical wave function
multipole expansion method