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Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Publikationstyp
Conference Paper
Date Issued
2015-09-02
Sprache
English
Institut
TORE-URI
Article Number
7237387
Citation
IEEE Workshop on Signal and Power Integrity, SPI: 7237387 (2015-09-02)
Contribution to Conference
Publisher DOI
Scopus ID
ISBN of container
978-146736581-9
A multipole expansion method for the efficient analysis of propagation modes along a Through-Silicon-Via pair is proposed. The method takes advantage of cylindrical wave expansion functions and matches exactly the boundary conditions at the metal-to-insulator and insulator-to-silicon interfaces. We verify the accuracy of the method by comparing to a full-wave finite element method solver.
Subjects
cylindrical wave function
multipole expansion method
Through-silicon-via