Options
Two-phase Loop Thermosiphon Coupled With Latent Heat Storage For Electronics Cooling
Publikationstyp
Conference Paper
Date Issued
2022-07
Sprache
English
Author(s)
Albertsen, Björn
Herausgeber*innen
Institut
Article Number
2375
Citation
19th International Refrigeration and Air Conditioning Conference at Purdue: 2375 (2022)
Contribution to Conference
Publisher Link
Publisher
Purdue University Libraries
In this study, a twophase loop thermosiphon cooling system is coupled with latent heat storages integrated in the evaporator and investigated experimentally. A test rig using the lowGWP refrigerant R1233zd(E) is set up with a maximum power of 1.3 kW (23.2 W cm-1), supplied by a dummy for the electronic component to be cooled. Dynamic application scenarios are divided into two general categories and examined using respective examples. The results show high potential for changes in the heat sink temperature, whereas varying heat loads are more challenging regarding design and dimensioning of the PCMevaporatorcomposites. In both cases, significant improvements can be achieved in terms of temperatures and uncritical operation time.