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  4. Enhancing the 3D patterning of MEMS : an extended toolbox
 
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Enhancing the 3D patterning of MEMS : an extended toolbox

Publikationstyp
Conference Paper
Date Issued
2023-10-23
Sprache
English
Author(s)
Rennpferdt, Lukas  
Mikrosystemtechnik E-7  
Bohne, Sven  
Mikrosystemtechnik E-7  
Trieu, Hoc Khiem  
Mikrosystemtechnik E-7  
TORE-URI
https://hdl.handle.net/11420/46380
Citation
Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023. - Berlin, 2023.
Contribution to Conference
10. MikroSystemTechnik Kongress 2023  
Scopus ID
2-s2.0-85196911858
ISBN
978-3-8007-6203-3
978-3-8007-6204-0
Micro-Electro-Mechanical-Systems (MEMS) are nowadays indispensable and typically fabricated using semiconductor technology methods. As the systems are getting more complex, methods for 3D patterning in MEMS become more relevant and useful. At the same time, established methods from 3D printing getting more precise and gaining ground in the fabrication of MEMS. Within this work, an approach for an extended toolbox is presented, which integrates the often one-step processes of 3D patterning into thetypically iterative process flows composed of the traditional semiconductor technology methods and thus improves the capabilities for the fabrication of 3D MEMS. For this, methods of 3D printing and 3D patterning in-volume and on surface are investigated with regard to compatibility with methods of the traditional semiconductor technology.
DDC Class
600: Technology
621: Applied Physics
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