Design challenges for high-speed digital links for automotive applications

Publikationstyp
Journal Article
Date Issued
2025-03-26
Sprache
English
Author(s)
Hernandez, Jose Enrique  
Klein, Christian
Alavi, Golzar  
El Ouardi, Abdessamad
Reuschel, Torsten  
Schuster, Christian  
Theoretische Elektrotechnik E-18  
TORE-URI
https://hdl.handle.net/11420/57098
Journal
IEEE electromagnetic compatibility magazine  
Volume
13
Issue
4
Start Page
88
End Page
95
Citation
IEEE Electromagnetic Compatibility Magazine 13 (4): 88-95 (2025)
Publisher DOI
10.1109/MEMC.2024.10942574
Scopus ID
2-s2.0-105003802787
Publisher
IEEE
This paper outlines the state of the art and future directions for high-speed links in modern automotive applications. The technological constraints of signal integrity (SI) are discussed in the context of challenges of the mechanical and atmospheric environment. The requirements are illustrated by example of automotive Ethernet and its use to establish communication between electronic control units (ECUs). The overview covers design elements and parts inside the ECU enclosure as well as the link segment in between control units. Moreover, the compound system is subject to operational testing and verification of compliance with applicable standards.
Subjects
automotive
ECU
high-speed
interconnects
PCB
signal integrity
DDC Class
621.3: Electrical Engineering, Electronic Engineering