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Microstructure refinement and bicontinuity formation by distributed internal melting at the Ni₃Sn₄ peritectic
Citation Link: https://doi.org/10.15480/882.16815
Publikationstyp
Journal Article
Date Issued
2026-02-23
Sprache
English
TORE-DOI
Volume
41
Start Page
6202
End Page
6210
Citation
Journal of Materials Research and Technology 41: 6202-6210 (2026)
Publisher DOI
Scopus ID
Publisher
Elsevier
ISSN
22387854
Guided by a current interest in processing schemes, such as liquid-metal dealloying, providing fine-scale bicontinuous metal microstructures, we investigate the microstructure evolution during the peritectic melting of Ni₃Sn₄. The product microstructure is an interconnected array of spherical clusters of crystallographically aligned Ni₃Sn₂ ligaments, interpenetrated by a contiguous liquid phase. When quenched to room temperature, the prevalent microstructure consists of two interpenetrating solid phases. Leaching the solidified Sn melt produces monolithic porous bodies of Ni₃Sn₂. The characteristic structure size can reach down to 2 μm, a microstructure refinement by almost 2 orders of magnitude as compared to the 150 μm grain size of the master alloy. Remarkably, a more severe refinement is achieved at higher annealing temperatures. Our experiments identify liquid-film migration as the controlling process, here concurrent with constitutional supercooling and cellular solidification. We argue that peritectic melting exemplifies a more general family of processes of distributed internal melting (DIM). These processes exploit the abundant nucleation of regions of melt, finely distributed throughout a parent microstructure, when the alloy is heated into a two-phase solid–liquid regime of its phase diagram. DIM provides a novel and versatile pathway to fine-scale bicontinuous microstructures.
Subjects
Constitutional supercooling
Liquid film migration
Liquid-metal dealloying
NiSn alloy
Peritectic melting
DDC Class
620.11: Engineering Materials
Publication version
publishedVersion
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1-s2.0-S2238785426004394-main.pdf
Type
Main Article
Size
5.04 MB
Format
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