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Development, validation, and application of semi-analytical interconnect models for efficient simulation of multilayer substrates
Citation Link: https://doi.org/10.15480/882.997
Other Titles
Entwicklung, Validierung und Anwendung von semianalytischen Verbindungsmodellen für effiziente Simulation der mehrlagigen Substrate
Publikationstyp
Doctoral Thesis
Date Issued
2011
Sprache
English
Author(s)
Advisor
Title Granting Institution
Technische Universität Hamburg
Place of Title Granting Institution
Hamburg
Examination Date
2010-12-17
Institut
TORE-DOI
This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.
Subjects
Durchkontaktierung
Signal-Integrität
Spannungsversorgung
digitalen Systemen
printed circuit board
package
parallel plates
power integrity
signal integrity
DDC Class
620: Ingenieurwissenschaften
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Name
Diss_RRimolo_TET_TUHH_2010_final.pdf
Size
16.39 MB
Format
Adobe PDF