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  4. Solid-material-based coupling efficiency analyzed with time-of-flight secondary ion mass spectrometry
 
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Solid-material-based coupling efficiency analyzed with time-of-flight secondary ion mass spectrometry

Publikationstyp
Journal Article
Date Issued
2016
Sprache
English
Author(s)
Muenster, Bastian
Welle, Alexander
Ridder, Barbara
Althuon, Daniela
Striffler, Jakob
Foertsch, Tobias C.  
Hahn, Lothar
Thelen, Richard  
Stadler, Volker  
Nesterov-Mueller, Alexander  
Breitling, Frank  
Loeffler, Felix F.  
TORE-URI
https://hdl.handle.net/11420/59160
Journal
Applied Surface Science  
Volume
360
Start Page
306
End Page
314
Citation
Applied Surface Science 360: 306-3014 (2016)
Publisher DOI
10.1016/j.apsusc.2015.10.223
Scopus ID
2-s2.0-84951926695
ISSN
01694332
The coupling behavior of a microparticle embedded amino acid active-ester into a Poly(ethylene glycol)methacrylate-film, synthesized onto a silicon wafer by a grafting from approach, is characterized using dynamic time-of-flight secondary ion mass spectrometry (ToF-SIMS) to analyze the 3d distribution of the amino acids in the polymer film. Besides standard solid phase peptide synthesis, employing solubilized amino acids in a solvent, we used solid polymer microparticles, incorporating the amino acids. These microparticles were especially designed for a new technique to produce high-density combinatorial peptide microarrays: upon heating, the particles become viscous, which releases the embedded amino acids to diffuse and couple to the surface. In the scope of the development of this new particle-based application, ToF-SIMS is used to analyze a complex chemically modified polymer surface layer. Due to depth profile measurements, it is possible to investigate the particle-based coupling reaction not only on the surface, but also into the depth of the PEGMA film.
Subjects
C 60 depth profiling
Combinatorial laser fusing
Functionalized PEGMA coated surfaces
High-density peptide arrays
Particle-based solid phase peptide synthesis
Secondary ion mass spectrometry
DDC Class
600: Technology
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