Broadband dual-via architectures for multilayer PCB signal injection and intra-layer transition

Publikationstyp
Conference Paper
Date Issued
2005-06
Sprache
English
Author(s)
Metz, Carsten  
Baras, Torben  
Lyons, Alan  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/11239
Journal
IEEE MTT-S International Microwave Symposium digest  
Volume
2005
Start Page
853
End Page
856
Article Number
1516752
Citation
IEEE MTT-S International Microwave Symposium (2005)
Contribution to Conference
IEEE MTT-S International Microwave Symposium 2005  
Publisher DOI
10.1109/MWSYM.2005.1516752
Scopus ID
2-s2.0-33749244983
In this paper two novel transmission line architectures for intra-layer transitions in multilayer printed circuit boards (PCBs) are presented. Based on a balanced power divider and combiner concept, these can significantly improve the broadband transmission behavior for transmission rates beyond 10GB/s. The electrical performance for state-of-the-art PCBs is reviewed, and compared to the novel approach by means of simulations and measurements.
Subjects
Combiner
Divider
Multilayer circuit boards
Stub resonance
Vias