CONMLS
Citation Link: https://doi.org/10.15480/882.17543
Other Titles
Code for the numerical computation of multilayer structures
Publikationstyp
Technical Report
Date Issued
2026-07-21
Sprache
English
Herausgeber*innen
TORE-DOI
CONMLS is a physics-based simulation framework for multilayer substrates enclosed by solid reference planes. It uses fast semi-analytical methods to model the vias, cavities, striplines and coaxial structures. These components are combined into a complete model of a printed circuit board using segmentation techniques. The results are S-parameters between the assigned via ports at the top and bottom planes of the stackup. This manual explains how to install CONMLS and describes all available features and the human-readable ASCII input files.
Subjects
multilayer substrates
via modeling
PCB simulation
signal integrity
power integrity
contour integral method
transmission lines
DDC Class
621.3: Electrical Engineering, Electronic Engineering
530: Physics
Publication version
publishedVersion