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Zuverlässigkeit von keramischen Mehrlagensubstraten
Citation Link: https://doi.org/10.15480/882.743
Other Titles
Reliability model for thick film resistors
Publikationstyp
Doctoral Thesis
Date Issued
2010
Sprache
German
Author(s)
Advisor
Title Granting Institution
Technische Universität Hamburg
Place of Title Granting Institution
Hamburg
Examination Date
2009-12-11
TORE-DOI
This PhD thesis describes a reliability model for thick film resistors. Microcracks existing inside the resistor may grow due to mechanical stresses. Because of a high glass portion in the material, pronounced subcritical crack growth can be observed. Not the crack growth itself, but the resistance change caused by the crack growth leads to the failure of the resistor. The developed reliability model describes this functional failure of the resistor, taking into account statistically distributed input parameters. The result of the reliability calculation is the failure probability as a function of time. A calculation procedure for the time dependent failure probability, a finite element crack growth simulation, material characterisation methods for
thick film materials and a verification experiment for the time dependent failure of the resistors is shown. The tolerance range of the calculated lifetimes is estimated by studying the influence of different input parameters. Due to the brittle material behaviour the lifetime of thick film resistors can only be calculated in the range of some orders of magnitude.
For currently used thick film resistors under usual operating load conditions the failure probability is negligibly small.
thick film materials and a verification experiment for the time dependent failure of the resistors is shown. The tolerance range of the calculated lifetimes is estimated by studying the influence of different input parameters. Due to the brittle material behaviour the lifetime of thick film resistors can only be calculated in the range of some orders of magnitude.
For currently used thick film resistors under usual operating load conditions the failure probability is negligibly small.
Subjects
Dickschichtwiderstände
unterkritisches Risswachstum
funktionelles Versagen
subcritical crack growth
resistor
reliability
crack growth simulation
DDC Class
620: Ingenieurwissenschaften
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Dissertation_Dorsch_2010.pdf
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