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Chebyshev filter design using vias as quasi-transmission lines in printed circuit boards
Publikationstyp
Journal Article
Date Issued
2015-02-10
Sprache
English
Institut
TORE-URI
Volume
63
Issue
3
Start Page
976
End Page
985
Article Number
7038228
Citation
IEEE Transactions on Microwave Theory and Techniques 3 (63): 7038228 976-985 (2015-03-01)
Publisher DOI
Scopus ID
Publisher
IEEE
This paper presents a novel concept for microwave filter design using vias (plated through-holes) in multilayered printed circuit boards. By using the concept that vias accompanied by a sufficient number of ground vias in close proximity can be approximated as transmission lines in a certain frequency range, corresponding effective impedances and phase velocities for different configurations of vias and ground vias are deduced. By controlling these transmission-line parameters, standard microwave filter methodology is applied for the design of low-pass and bandpass Chebychev filters in the frequency range of 5-20 GHz. Measurements and full-wave simulation results are presented as validation. Advantages and limitations of the proposed method are discussed.
Subjects
Filter
microwave components
passive filter
plated through holes
printed circuit board (PCB)
via
DDC Class
600: Technik