Design of Wideband Functional Via Structures for LTCC Multilayer Substrates up to 110 GHz

Publikationstyp
Conference Paper
Publikationsdatum
2019-12-16
Sprache
English
Author
Yildiz, Ömer Faruk 
Schuster, Christian 
Institut
Theoretische Elektrotechnik E-18 
TORE-URI
http://hdl.handle.net/11420/4320
Citation
IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS): (2019-12-16).
Contribution to Conference
IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS 2019) 
Publisher DOI
10.1109/EDAPS47854.2019.9011681
Scopus ID
2-s2.0-85085022629
Publisher
IEEE
DDC Class
000: Allgemeines, Wissenschaft