Design of Wideband Functional Via Structures for LTCC Multilayer Substrates up to 110 GHz

Publikationstyp
Conference Paper
Date Issued
2019-12
Sprache
English
Author(s)
Yildiz, Ömer Faruk
Schuster, Christian
Institut
Theoretische Elektrotechnik E-18
TORE-URI
http://hdl.handle.net/11420/4320
Citation
IEEE Electrical Design of Advanced Package & Systems Symposium, (EDAPS 2019)
Contribution to Conference
IEEE Electrical Design of Advanced Package & Systems Symposium, (EDAPS 2019)
Publisher DOI
10.1109/EDAPS47854.2019.9011681
Scopus ID
2-s2.0-85085022629
Publisher
IEEE
ISBN of container
978-1-7281-2432-2
978-1-7281-2431-5
978-1-7281-2433-9
DDC Class
000: Allgemeines, Wissenschaft