Electrical performance of a multiport interposer for measurements of dense via arrays

Start Page
43
End Page
46
Article Number
5898837
Citation
2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings (): 5898837 43-46 (2011-08-03)
Contribution to Conference
15th IEEE Workshop on Signal Propagation on Interconnects, SPI 2011  
Publisher DOI
10.1109/SPI.2011.5898837
Scopus ID
2-s2.0-79960895920
Publisher
IEEE
In this paper the bandwidth limitations of two types of multiport probing fixtures for measurements of high density via array structures are investigated. Using a two-tier calibration technique and custom-made calibration substrates, error parameters for the probing fixtures were extracted and used to evaluate variability in measurements and substrate correction parameters. Results show adequate repeatability of the obtained error parameters up to 20 GHz. Digital links were measured utilizing these probing fixtures and results were compared to S-parameter measurements using RF microprobes. Good correlation up to 10 GHz - 15 GHz was established when compared to microprobe based measurements of link structures with stub access vias. For link structures with through access vias the adequate correlation bandwidth was founded to be 5 GHz - 10 GHz.
DDC Class
600: Technik
620: Ingenieurwissenschaften