Sensitivity analysis of via impedance using polynomial chaos expansion

Publikationstyp
Conference Paper
Date Issued
2015-09-02
Sprache
English
Author(s)
Preibisch, Jan  
Triverio, Piero  
Schuster, Christian  
Institut
Theoretische Elektrotechnik E-18  
TORE-URI
http://hdl.handle.net/11420/7209
Article Number
7237386
Citation
IEEE Workshop on Signal and Power Integrity, SPI: 7237386 (2015-09-02)
Contribution to Conference
IEEE Workshop on Signal and Power Integrity, SPI 2015  
Publisher DOI
10.1109/SaPIW.2015.7237386
Scopus ID
2-s2.0-84957928136
This work addresses the sensitivity of the characteristic via impedance used in high-speed digital systems with respect to variations of geometrical parameters. For modeling of the electromagnetic characteristics of a signal via surrounded by ground vias the physics-based via (PBV) model is used, which provides an equivalent circuit representation for a via interconnect. This circuit is augmented element-wise using polynomial chaos expansion (PCE) to include variability in form of stochastic parameters. This representation is used to derive a stochastic characteristic via impedance. The proposed method is validated with Monte-Carlo (MC) simulations and is proven to be more efficient. Finally, the sensitivity of a via on a printed circuit board (PCB) and a via on a glass interposer with respect to variations of geometrical parameters are analyzed.