Measurement of Temperature and Humidity Dependence of Automotive-Grade Interconnects

Publikationstyp
Conference Paper
Date Issued
2023-01-01
Sprache
English
Author(s)
Bonilla, Jose Enrique Hernandez
Alavi, Golzar
Yang, Cheng  
Theoretische Elektrotechnik E-18  
Schuster, Christian  
Theoretische Elektrotechnik E-18  
TORE-URI
https://hdl.handle.net/11420/42422
Citation
27th IEEE Workshop on Signal and Power Integrity (SPI 2023)
Contribution to Conference
27th IEEE Workshop on Signal and Power Integrity, SPI 2023  
Publisher DOI
10.1109/SPI57109.2023.10145521
Scopus ID
2-s2.0-85163373528
ISBN
9798350332827
In this study, the effect of harsh environments on the insertion loss profile of automotive-grade high-speed interconnects was studied. Measurements under three different use conditions were performed to study the effect of humidity and temperature in signal integrity performance. Measurements at nominal conditions were used to extract the insertion loss per inch using two different de-embedding methods. Temperature and humidity variations were applied to three printed circuit board stack-ups fabricated with different base materials and copper foils. The insertion loss was measured for the environment changes and compared between the boards. An increase in the insertion loss profile was observed for temperature and humidity variations in all the boards.
Subjects
automotive electronic
harsh environment
high-speed
interconnect