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Dielectric breakdown toughness from filament induced dielectric breakdown in borosilicate glass
Citation Link: https://doi.org/10.15480/882.1761
Publikationstyp
Journal Article
Date Issued
2018-05-28
Sprache
English
Author(s)
Fischer, Pia-Kristina
TORE-DOI
Volume
38
Issue
13
Start Page
4476
End Page
4482
Citation
Journal of the European Ceramic Society 13 (38): 4476-4482 (2018)
Publisher DOI
Scopus ID
Publisher
Elsevier
The dielectric breakdown strength of borosilicate glass was measured as a function of the length of a conducting filament in order to determine the critical energy release for the growth of a breakdown channel. The concept is similar to the experimental determination of the toughness in fracture mechanics and based on a Griffith type
model for the electrical energy release rate in dielectric materials with space charge limited conductivity. By Focused-Ion-Beam-milling and Pt-deposition, up to 100 μm long conductive channels were fabricated in 163 μm thick borosilicate glass substrates. The dielectric breakdown strength of substrates with filaments longer than 30 μm could be very well described by a filament length 1 -dependence predicted by the model Schneider, 2013. With these results for the first time a critical energy release rate for dielectric breakdown was determined being 6.30 ± 0.95 mJ/m.
model for the electrical energy release rate in dielectric materials with space charge limited conductivity. By Focused-Ion-Beam-milling and Pt-deposition, up to 100 μm long conductive channels were fabricated in 163 μm thick borosilicate glass substrates. The dielectric breakdown strength of substrates with filaments longer than 30 μm could be very well described by a filament length 1 -dependence predicted by the model Schneider, 2013. With these results for the first time a critical energy release rate for dielectric breakdown was determined being 6.30 ± 0.95 mJ/m.
Subjects
dielectric breakdown
dielectric breakdown strength
dielectric breakdown toughness
energy release rate
conductive filament
DDC Class
620: Ingenieurwissenschaften
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