Options
Environmental evaluation of LTCC flip-chip and surface mount technology for satellite applications
Publikationstyp
Journal Article
Date Issued
2008-10-01
Sprache
English
Institut
Journal
Volume
62
Issue
9-10
Start Page
222
End Page
228
Citation
Frequenz 62 (9-10): 222-228 (2008-01-01)
Contribution to Conference
Publisher DOI
Scopus ID
Publisher
VDE
An environmental qualification of a hybrid technology for satellite applications is presented. It is based on low temperature co-fired ceramic modules attached in a surface mount technology to a mother board on an aluminum base plate. For the module assembly flip-chip mounting using ultrasonic and thermocompression bonding is considered. As a validation the circuits are exposed to numerous mechanical and thermal testing procedures. In three qualification steps the different manufacturing methods are evaluated and discussed.
Subjects
Flip-chip
Hybrid
LTCC
DDC Class
600: Technik