Environmental evaluation of LTCC flip-chip and surface mount technology for satellite applications
An environmental qualification of a hybrid technology for satellite applications is presented. It is based on low temperature co-fired ceramic modules attached in a surface mount technology to a mother board on an aluminum base plate. For the module assembly flip-chip mounting using ultrasonic and thermocompression bonding is considered. As a validation the circuits are exposed to numerous mechanical and thermal testing procedures. In three qualification steps the different manufacturing methods are evaluated and discussed.