Thermal packaging concept for LTCC microwave power applications

Publikationstyp
Conference Paper
Date Issued
2008
Sprache
English
Author(s)
Baras, Torben  
Jacob, Arne  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/10751
Start Page
446
End Page
449
Citation
German Microwave Conference, GEMIC 2008 (): Seite 446-449 (2008-01-01)
Contribution to Conference
3rd German Microwave Conference, GeMiC 2008  
Publisher
VDE-Verlag
DDC Class
600: Technik
620: Ingenieurwissenschaften