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  4. Custom-made calibration standards for measurements of multilayer substrates
 
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Custom-made calibration standards for measurements of multilayer substrates

Publikationstyp
Conference Paper
Date Issued
2011
Sprache
English
Author(s)
Kotzev, Miroslav A.  
Theoretische Elektrotechnik E-18  
Schuster, Christian  
Theoretische Elektrotechnik E-18  
TORE-URI
https://hdl.handle.net/11420/43816
Article Number
5760793
Citation
German Microwave Conference (GeMiC), 2011 : 14 - 16 March 2011, Darmstadt, Germany / IEEE - Proceedings. - Pscataway, N.J., 2011.
Contribution to Conference
German Microwave Conference, GeMiC 2011  
Publisher Link
https://ieeexplore.ieee.org/document/5760793
Scopus ID
2-s2.0-79957506582
Publisher
IEEE
ISBN
978-3-9812668-2-5
978-1-4244-9225-1
In this paper the authors present custom-made calibration standards for microprobe based measurements on multilayer printed circuit boards. Non ideal short, open and load (SOL) terminations are positioned at the end of through holes (vias). The combination of via plus termination forms a custom-made standard for printed circuit board measurements. The load standard consists of a soldered 47 Ohm (SMD, 0402, 1%) resistor, a solder bridge is used as a short and for the open the via is left open. The usable bandwidth of the standards is studied with the help of a two-tier calibration method. Comparisons of measurements performed on the same device under test using either the microprobe vendor calibration substrate or the custom-made standards show good correlation in the frequency bandwidth from 10 MHz up to 30 GHz. © 2011 Institut fur Mikrowellen.
Subjects
calibration standards
microprobes
multilayer printed circuit boards
Two-tier calibration
vector network analyzer
DDC Class
600: Technology
620: Engineering
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