Comparison of high resolution patterning technologies for LTCC microwave circuits

Start Page
98
End Page
103
Citation
Proceedings of the IMAPS/ACerS 3rd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2007) : April 23 - 26, 2007, Grand Hyatt Hotel, Denver, Colorado / International Microelectronics and Packaging Society (IMAPS); American Ceramic Society (ACerS). - Washington, DC, 2007. - Pp. 98-103
Contribution to Conference
3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007  
Publisher
International Microelectronics and Packaging Society
DDC Class
600: Technik
620: Ingenieurwissenschaften