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  4. Probing and fixturing techniques for wideband multiport measurements in digital packaging
 
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Probing and fixturing techniques for wideband multiport measurements in digital packaging

Citation Link: https://doi.org/10.15480/882.1113
Other Titles
Kontaktierungs- und Signaleinführungstechniken für breitbandige Multitor-Messungen im Bereich der Aufbau- und Verbindungstechnik für digitale Systeme
Publikationstyp
Doctoral Thesis
Date Issued
2013
Sprache
English
Author(s)
Kotzev, Miroslav A.  
Advisor
Schuster, Christian  
Title Granting Institution
Technische Universität Hamburg
Place of Title Granting Institution
Hamburg
Examination Date
2013-02-01
Institut
Theoretische Elektrotechnik E-18  
TORE-DOI
10.15480/882.1113
TORE-URI
http://tubdok.tub.tuhh.de/handle/11420/1115
This thesis deals with test signal probing and fixturing techniques for wideband multiport measurements in digital packaging in the frequency range from a few MHz to 50 GHz. Three different signal launch techniques are investigated in time and frequency domains. At first, the performance of the coaxial surface mounted connector launch is explored in case of crosstalk measurements in a backplane connector via pin field. In the next step the recessed probe launch technique is briefly presented. After that the main focus is on the results obtained in recent investigations with respect to the launch calibration, application to measurements of embedded multilayer structures and modifications to improve the launch bandwidth. Finally, the concept of a novel multiport probing fixture is presented and its electrical performance explored. Using a simple two-tier calibration procedure, the effect of the probing fixture on measurements of dense via array structures is reduced and the results obtained are validated with microprobe based measurements. Based on 3D full-wave electromagnetic modeling, suggestions for layout optimization are made which will be needed to extend the applicability of these techniques to data rates of 20 Gbit/s and beyond.
Subjects
dense via arrays
multiport measurement
multiport probing
multilayer printed circuit boards
packaging
recessed probe launch
VNA
DDC Class
004:Informatik
Lizenz
http://doku.b.tu-harburg.de/doku/lic_mit_pod.php
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