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  4. Functional via structures in passive microwave components on multilayer ceramic substrates
 
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Functional via structures in passive microwave components on multilayer ceramic substrates

Publikationstyp
Doctoral Thesis
Date Issued
2023
Sprache
English
Author(s)
Yildiz, Ömer Faruk  
Advisor
Schuster, Christian  
Referee
Jacob, Arne  
Title Granting Institution
Technische Universität Hamburg
Place of Title Granting Institution
Hamburg
Examination Date
2022-06-17
Institut
Theoretische Elektrotechnik E-18  
TORE-URI
http://hdl.handle.net/11420/15163
Citation
Shaker 978-3-8440-9002-4: (2023)
Publisher
Shaker
DDC Class
600: Technik
TUHH
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