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Design and implementation of an integrated RF system-in-package for healthcare applications
Publikationstyp
Conference Paper
Date Issued
2010
Sprache
English
Article Number
5642857
Citation
3rd Electronics System Integration Technology Conference ESTC, Berlin, Germany, 2010, pp. 1-5
Contribution to Conference
Publisher DOI
Scopus ID
ISBN
978-1-4244-8553-6
978-1-4244-8554-3
A 3 channel ECG system with wireless data transmission is presented. It is built as a System in Package (SiP) consisting of 6 dies and 39 SMD components mounted on a FR4 substrate at a size of 2.45 x 2.45 mm2. Design considerations and ASIC partitioning is addressed in this work. In addition, measurement results are presented proving that a SiP can compete with a System on Chip.
DDC Class
621.3: Electrical Engineering, Electronic Engineering