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Via array modeling for application in fast, energy-efficient digital systems
Citation Link: https://doi.org/10.15480/882.1219
Other Titles
Modellierung von Via-Arrays für den Einsatz in schnellen, energieeffizienten digitalen Systemen
Publikationstyp
Doctoral Thesis
Date Issued
2014
Sprache
German
Author(s)
Advisor
Title Granting Institution
Technische Universität Hamburg
Place of Title Granting Institution
Hamburg
Examination Date
2014-10-31
Institut
TORE-DOI
This thesis studies the application of physics-based via models for an efficient modeling of large via arrays in multilayer PCBs. Three main aspects are addressed: the study and improvement of the modeling accuracy, the study and improvement of the model efficiency, and the application of the model in a systematic evaluation of via array design alternatives for high speed links.
With regard to the modeling accuracy, the application of an improved local field model is identified as a suitable way to improve the model accuracy for the simulation of via arrays, especially at frequencies above 20 GHz. With the improved model, an accurate simulation of via arrays with a pitch of 60 mil or larger becomes possible in the frequency range up to 50 GHz. Improvements with regard to the model efficiency lead to a reduction of calculation times which allows to carry out fast design explorations for smaller via arrays on a standard PC. Finally, an approach for a systematic design evaluation is presented which integrates the advantages of the efficient physics-based via model in a larger concept. With the approach, a quantitative comparison of design alternatives becomes possible that takes into account the impact of design changes
With regard to the modeling accuracy, the application of an improved local field model is identified as a suitable way to improve the model accuracy for the simulation of via arrays, especially at frequencies above 20 GHz. With the improved model, an accurate simulation of via arrays with a pitch of 60 mil or larger becomes possible in the frequency range up to 50 GHz. Improvements with regard to the model efficiency lead to a reduction of calculation times which allows to carry out fast design explorations for smaller via arrays on a standard PC. Finally, an approach for a systematic design evaluation is presented which integrates the advantages of the efficient physics-based via model in a larger concept. With the approach, a quantitative comparison of design alternatives becomes possible that takes into account the impact of design changes
Subjects
Signalintegrität
printed circuit board
via
modeling
simulation
signal integrity
energy efficiency
digital system
DDC Class
620: Ingenieurwissenschaften
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