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Using coupled vias for band-pass filters in multilayered printed-circuit boards
Publikationstyp
Conference Paper
Date Issued
2015-05-13
Sprache
English
Author(s)
Institut
TORE-URI
Start Page
88
End Page
90
Article Number
7107759
Citation
German Microwave Conference, GeMiC: 7107759 (2015-05-13)
Contribution to Conference
Publisher DOI
Scopus ID
This contribution extends previous work of the authors on microwave couplers using vias (plated through holes). In [1] a novel concept for microwave coupler design using vias in multilayered printed circuit boards (PCBs) was presented. By placing thru vias inside a ground via cage, high coupling between the vias can be observed. In this work it is shown that appropriate definition of via ports leads to a filter behavior of the structure. By adjusting the dimensions of the structure and by adding further thru vias the filter behavior can be controlled. Results are validated by physics-based and full-wave simulations up to 40 GHz.
Subjects
band-pass filters
coupled vias
functional vias
PCB
physics-based models