Options
Modeling and improving transmission of high-speed vias on PCBs up to 200 Ghz
Publikationstyp
Conference Paper
Date Issued
2026-06-14
Sprache
English
Author(s)
Sismanis, Nikolaos
Bouzianas, Georgios
Citation
30th IEEE Workshop on Signal and Power Integrity, SPI 2026
Contribution to Conference
Publisher DOI
Scopus ID
Publisher
IEEE
ISBN of container
979-833159075-8
As high-speed interconnects on printed circuit boards (PCBs) advance into the beyond 400 Gbps domain, accurate characterization of vias becomes critical. Via arrays are investigated at frequencies up to 200 GHz using different full-wave (FW) simulation tools, yielding good correlation. Scattering phenomena play a more significant role than losses in the behavior of these arrays. Considerations essential for improved interconnect performance in next-generation highspeed communication systems, increasing bandwidth by 20 GHz, are outlined. Coax vias and interstitial ground vias improving transmission are investigated.
Subjects
high-speed
modeling
printed circuit boards
signal integrity
via array
DDC Class
621.3: Electrical Engineering, Electronic Engineering