Electrical and thermomechanical evaluation of 2nd-level-interconnects for LTCC modules

Publikationstyp
Conference Paper
Date Issued
2006
Sprache
English
Author(s)
Baras, Torben  
Corrales Hernández, Maria  
Jacob, Arne  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/11021
Start Page
1142
End Page
1147
Citation
Proceedings of the 39th International Symposium on Microelectronics (IMAPS), San Diego, California, USA. - Pp. 1142-1147 (2006)
Contribution to Conference
39th International Symposium on Microelectronics, IMAPS 2006  
DDC Class
600: Technik
620: Ingenieurwissenschaften