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Comprehensive multilayer substrate models for co-simulation of power and signal integrity
Publikationstyp
Conference Paper
Date Issued
2009
Sprache
English
Start Page
969
End Page
976
Citation
42th International Symposium on Microelectronics 2009
Contribution to Conference
Publisher DOI
Publisher
International Microelectronics Assembly and Packaging Society (IMAPS)
ISBN of container
978-0-930815-89-9
Physics-based via and trace models have been integrated into a general method to simulate multilayer board structures. In the past, our approach has been successfully applied to link simulation and has been validated against other numerical techniques and measurements. A notable improvement of the computation speed of over three orders of magnitude has been observed when compared to full-wave electromagnetic simulations. In this paper, the models are reviewed and it is shown that they can also be applied to simulate power distribution networks with arbitrary power/ground via and plane configurations. This approach is general enough to handle indistinctively power and signal nets and it is therefore suitable for co-simulation of both power and signal integrity domains in a comprehensive and efficient manner. Different configurations are studied in this paper, including also decoupling capacitors, and the simulation results are compared against full- wave simulations in terms of accuracy and efficiency.
DDC Class
600: Technology