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  4. Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels
 
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Modeling S-parameters of Interconnects using Periodic Gaussian Process Kernels

Publikationstyp
Conference Paper
Date Issued
2023-05
Sprache
English
Author(s)
Garbuglia, Federico
Spina, Domenico  
Reuschel, Torsten  
University of New Brunswick, Fredericton, NB, Canada
Schuster, Christian  
Theoretische Elektrotechnik E-18  
Deschrijver, Dirk  
Dhaene, Tom
TORE-URI
https://hdl.handle.net/11420/42423
Citation
27th IEEE Workshop on Signal and Power Integrity (SPI 2023)
Contribution to Conference
27th IEEE Workshop on Signal and Power Integrity, SPI 2023  
Publisher DOI
10.1109/SPI57109.2023.10145548
Scopus ID
2-s2.0-85163328556
ISBN
9798350332827
In this paper, we present a novel technique to model wide-band scattering parameter (S-parameter) curves of high-speed digital interconnects. The proposed technique utilizes a new kernel function with periodic components for Gaussian process (GP) models. After proper training, the GP models are able to predict the S-parameter values at arbitrary frequency points inside the trained interval. The performance of the proposed technique is reviewed by means of correlation with standard Gaussian Processes with squared exponential kernel and Matern kernel. Results for the proposed technique show an increased prediction accuracy when applied to interconnects.
Subjects
Gaussian processes (GP)
Interconnects
kernels
machine learning (ML)
S-parameters
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