Broadband Circuit Board Interconnects Based on Anisotropic Conductive Adhesives

Publikationstyp
Conference Paper
Date Issued
2022-09
Sprache
English
Author(s)
Erkelenz, Kevin  
Sielck, Noah  orcid-logo
Kölpin, Alexander  orcid-logo
Jacob, Arne  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/14153
Start Page
155
End Page
158
Citation
52nd European Microwave Conference (EuMC 2022)
Contribution to Conference
52nd European Microwave Conference, EuMC 2022  
Publisher DOI
10.23919/EuMC54642.2022.9924505
Scopus ID
2-s2.0-85142290068
Commonly, printed circuit board (PCB) interconnects are realized as plated through-hole arrangements or even by means of connectors. To avoid the associated complexity and reduce the manufacturing effort and cost, we propose as an alternative the use of anisotropic conductive adhesives (ACAs). The approach is especially suitable for systems with high integration density and challenging circuit complexity, such as phased array antennas. Two different commercially available ACAs are considered to realize interconnects - here between two single-layer PCBs. The measurements performed up to 40 GHz yield transmission coefficients exceeding -1.4 dB and reflection coefficients below -13 dB, thus confirming the validity of the approach.
Subjects
Anisotropic Conductive Adhesive (ACA)
Anisotropic Conductive Paste (ACP)
Broadband
Interconnection
Multilayer
Phased Array
Printed Circuit Board (PCB)
Transition
Via