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Publisher DOI: 10.1002/smtd.202201183
Title: Printing crack‐free microporous structures by combining additive manufacturing with colloidal assembly
Language: English
Authors: Winhard, Benedikt 
Maragno, Laura G. 
Gomez Gomez, Alberto 
Katz, Julian 
Pagnan Furlan, Kaline  
Keywords: additive manufacturing; coffee ring effect; colloids; crack-free structures; microfluidics; photonic structures; self-assembly
Issue Date: Feb-2023
Publisher: WILEY-VCH Verlag GmbH & Co. KGaA
Source: Small Methods 7 (2): 2201183 (2023)
Abstract (english): 
To date high printing resolution and scalability, i.e., macroscale component dimensions and fast printing, are incompatible characteristics for additive manufacturing (AM) processes. It is hereby demonstrated that the combination of direct writing as an AM process with colloidal assembly enables the breaching of this processing barrier. By tailoring printing parameters for polystyrene (PS) microparticle-templates, how to avoid coffee ring formation is demonstrated, thus printing uniform single lines and macroscale areas. Moreover, a novel “comb”-strategy is introduced to print macroscale, crack-free colloidal coatings with low viscous colloidal suspensions. The printed templates are transformed into ceramic microporous channels as well as photonic coatings via atomic layer deposition (ALD) and calcination. The obtained structures reveal promising wicking capabilities and broadband reflection in the near-infrared, respectively. This work provides guidelines for printing low viscous colloidal suspensions and highlights the advancements that this printing process offers toward novel applications of colloidal-based printed structures.
DOI: 10.15480/882.4815
ISSN: 2366-9608
Journal: Small Methods 
Institute: Keramische Hochleistungswerkstoffe M-9 
Integrated Ceramic-based Materials Systems M-EXK3 
Document Type: Article
Project: SFB 986: Teilprojekt C04 - Additive Fertigung durch Selbstassemblierung kolloidaler Suspensionen für maßgeschneiderte photonische Eigenschaften 
Projekt DEAL 
License: CC BY 4.0 (Attribution) CC BY 4.0 (Attribution)
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