Please use this identifier to cite or link to this item: https://doi.org/10.15480/882.1761
This item is licensed with a CreativeCommons licence by/4.0
Publisher DOI: 10.1016/j.jeurceramsoc.2018.05.036
Title: Dielectric breakdown toughness from filament induced dielectric breakdown in borosilicate glass
Language: English
Authors: Fischer, Pia-Kristina 
Schneider, Gerold A. 
Keywords: dielectric breakdown;dielectric breakdown strength;dielectric breakdown toughness;energy release rate;conductive filament
Issue Date: 28-May-2018
Publisher: Elsevier
Source: Journal of the European Ceramic Society 13 (38): 4476-4482 (2018)
Journal or Series Name: Journal of the European Ceramic Society 
Abstract (english): The dielectric breakdown strength of borosilicate glass was measured as a function of the length of a conducting filament in order to determine the critical energy release for the growth of a breakdown channel. The concept is similar to the experimental determination of the toughness in fracture mechanics and based on a Griffith type model for the electrical energy release rate in dielectric materials with space charge limited conductivity. By Focused-Ion-Beam-milling and Pt-deposition, up to 100 μm long conductive channels were fabricated in 163 μm thick borosilicate glass substrates. The dielectric breakdown strength of substrates with filaments longer than 30 μm could be very well described by a filament length 1 -dependence predicted by the model Schneider, 2013. With these results for the first time a critical energy release rate for dielectric breakdown was determined being 6.30 ± 0.95 mJ/m.
URI: http://tubdok.tub.tuhh.de/handle/11420/1764
DOI: 10.15480/882.1761
ISSN: 0955-2219
Institute: Keramische Hochleistungswerkstoffe M-9 
Type: (wissenschaftlicher) Artikel
Appears in Collections:Publications (tub.dok)

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