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  4. Via Transition Optimization Using a Domain Decomposition Approach
 
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Via Transition Optimization Using a Domain Decomposition Approach

Publikationstyp
Conference Paper
Date Issued
2019-06
Sprache
English
Author(s)
Carmona-Cruz, Allan  
Scharff, Katharina  
Cedeño-Chaves, Jonathan  
Brüns, Heinz-Dietrich  
Rimolo-Donadio, Renato  
Schuster, Christian  
Institut
Theoretische Elektrotechnik E-18  
TORE-URI
http://hdl.handle.net/11420/3264
Article Number
8781679
Citation
IEEE 23rd Workshop on Signal and Power Integrity : 8781679 (2019-06)
Contribution to Conference
IEEE 23rd Workshop on Signal and Power Integrity, SPI 2019  
Publisher DOI
10.1109/SaPIW.2019.8781679
Scopus ID
2-s2.0-85070886648
A method to minimize the return loss for via interconnects on printed circuit boards (PCB), based on the domain decomposition of traces, via barrels, and trace-to-via transitions is presented. This decomposition allows to optimize different via lengths, by separating the via barrel as an independent domain. The method is demonstrated by full-wave simulations. It starts by optimizing the via impedance, matching the traces by an appropriate size of the via environment followed by a subsequent compensation of trace-to-via transition discontinuities. Equivalent circuits of each domain are used to corroborate the performance improvement. Three pad geometries are proposed to compensate the discontinuities of a trace-to-via transition. For a long via on a PCB with eleven metal layers, using four ground vias, it was possible to achieve a wide-band low-reflection response below -30 dB from DC up to 32 GHz for microstrip traces and -37 dB from DC up to 20 GHz for stripline traces.
Subjects
Compensation
domain decomposition
printed circuit board
signal integrity
trace-to-via transition
vertical interconnect
via impedance
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