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  4. Microelectromechanical implants : encapsulation concepts and test procedures
 
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Microelectromechanical implants : encapsulation concepts and test procedures

Publikationstyp
Journal Article
Date Issued
2012-08-27
Sprache
English
Author(s)
Betz, Wolfgang  
Trieu, Hoc Khiem  
Vogt, Holger  
Institut
Mikrosystemtechnik E-7  
TORE-URI
http://hdl.handle.net/11420/3579
Journal
Biomedical engineering : joint journal of the German Society for Biomedical Engineering in VDE and the Austrian and Swiss Societies for Biomedical Engineering  
Volume
57
Issue
Suppl. 1 Track-D
Start Page
914
Citation
Biomedizinische Technik Suppl. 1 Track-D (57): 914 (2012-01-01)
Publisher DOI
10.1515/bmt-2012-4292
Scopus ID
2-s2.0-85026077736
Publisher
De Gruyter
DDC Class
570: Biowissenschaften, Biologie
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