Publisher DOI: | 10.1109/TCPMT.2015.2497466 | Title: | A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions | Language: | English | Authors: | Duan, Xiaomin Dahl, David Ndip, Ivan N. Lang, Klaus-Dieter Schuster, Christian |
Keywords: | Cylindrical wave function; multipole expansion method (MEM); through-silicon-via (TSV). | Issue Date: | 25-Nov-2015 | Publisher: | IEEE | Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6): 7337412, 117-125 (2016-01-01) | Abstract (english): | This paper presents a novel multipole expansion method for the rigorous analysis of wave propagation along a through-silicon-via (TSV) pair. TSV models are often constructed using equivalent circuits under the assumption that the interfaces between different media are equipotential. In comparison with that, the proposed method is a rigorous full-wave solution of the propagation mode. It takes advantage of cylindrical wave expansion functions and matches the boundary conditions at both the metal-to-insulator and insulator-to-silicon interfaces exactly. The method is validated against a full-wave finite-element method solver, and analysis examples using the method are demonstrated in a frequency range up to 100 GHz. |
URI: | http://hdl.handle.net/11420/5250 | ISSN: | 2156-3950 | Journal: | Institute: | Theoretische Elektrotechnik E-18 | Document Type: | Article | Project: | Elektrische Modellbildung, Charakterisierung und Entwurf von Silizium-Durchkontaktierungen für Anwendungen in integrierten Systemen |
Appears in Collections: | Publications without fulltext |
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