Publisher DOI: 10.1109/TCPMT.2015.2497466
Title: A rigorous approach for the modeling of through-silicon-via pairs using multipole expansions
Language: English
Authors: Duan, Xiaomin 
Dahl, David 
Ndip, Ivan N. 
Lang, Klaus-Dieter 
Schuster, Christian 
Keywords: Cylindrical wave function;multipole expansion method (MEM);through-silicon-via (TSV).
Issue Date: 25-Nov-2015
Publisher: IEEE
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6): 7337412, 117-125 (2016-01-01)
Journal or Series Name: IEEE transactions on components, packaging and manufacturing technology 
Abstract (english): This paper presents a novel multipole expansion method for the rigorous analysis of wave propagation along a through-silicon-via (TSV) pair. TSV models are often constructed using equivalent circuits under the assumption that the interfaces between different media are equipotential. In comparison with that, the proposed method is a rigorous full-wave solution of the propagation mode. It takes advantage of cylindrical wave expansion functions and matches the boundary conditions at both the metal-to-insulator and insulator-to-silicon interfaces exactly. The method is validated against a full-wave finite-element method solver, and analysis examples using the method are demonstrated in a frequency range up to 100 GHz.
ISSN: 2156-3950
Institute: Theoretische Elektrotechnik E-18 
Type: (wissenschaftlicher) Artikel
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