Publisher DOI: 10.1109/TCPMT.2013.2264755
Title: Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
Language: English
Authors: Gu, Xiaoxiong 
Silberman, Joel A. 
Young, Albert M. 
Jenkins, Keith A. 
Dang, Bing 
Liu, Yong 
Duan, Xiaomin 
Gordin, Rachel 
Shlafman, Shlomo 
Goren, David 
Keywords: 3-D integrated circuit (IC); 3-D integration; On-chip interconnect; Signal integrity; Substrate noise; Through-silicon-via (TSV)
Issue Date: 30-Oct-2013
Publisher: IEEE
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology 11 (3): Art. 6650001 i.e. Seite 1917-1925 (2013)
Abstract (english): 
Electrical loss and substrate noise coupling induced by through-silicon-vias (TSVs) in silicon-on-insulator (SOI) substrates is characterized in frequency and time domains. A three-dimensional (3-D) test site in 45-nm CMOS SOI including copper-filled TSVs and microbumps (μC4's) is fabricated and measured to extract the interconnect loss. Good correlation to the electrical circuit models is demonstrated up to 40 GHz. In addition to a buried oxide layer, a highly doped N+ epilayer used for deep trench devices in 22-nm CMOS SOI is considered in full-wave electromagnetic simulations. Equivalent circuit models are extracted to assess the impact of noise coupling on active circuit performance. A noise mitigation technique of using CMOS process compatible buried interface contacts is proposed and studied. Simulation results demonstrate that a low-impedance ground return path can be readily created for effective substrate noise reduction in 3-D IC design. © 2013 IEEE.
ISSN: 2156-3950
Journal: IEEE transactions on components, packaging and manufacturing technology 
Institute: Theoretische Elektrotechnik E-18 
Document Type: Article
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