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  4. Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates
 
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Physics-based via and waveguide models for efficient SIW simulations in multilayer substrates

Publikationstyp
Journal Article
Date Issued
2015-04-30
Sprache
English
Author(s)
Preibisch, Jan  
Hardock, Andreas  
Schuster, Christian  
Institut
Theoretische Elektrotechnik E-18  
TORE-URI
http://hdl.handle.net/11420/6344
Journal
IEEE transactions on microwave theory and techniques / Symposium issue  
Volume
63
Issue
6
Start Page
1809
End Page
1816
Article Number
7098447
Citation
IEEE Transactions on Microwave Theory and Techniques 6 (63): 7098447 1809-1816 (2015-06-01)
Publisher DOI
10.1109/TMTT.2015.2421498
Scopus ID
2-s2.0-84957964272
Publisher
IEEE
In this paper, the conventional physics-based via (PBV) model is extended to multilayer substrate integrated waveguide (SIW) structures with via feeds. Furthermore, a novel PBV model for a more efficient modeling of multilayer SIW is proposed. This novel method allows to describe SIWs as transmission lines and to model the coupling between the layers with an equivalent circuit near-field model. Both PBV models are compatible and can be combined within a framework for modeling complex multilayer SIWs in an efficient manner. Results obtained by both methods are compared with full-wave solver results and show very good agreement from below cutoff frequency to about three times the cutoff frequency as well as a speed up of several orders of magnitude.
Subjects
Contour integral method (CIM)
Physics-based via (PBV) model
Substrate integrated waveguide (SIW)
DDC Class
600: Technik
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