Publisher DOI: 10.1109/TMTT.2018.2873368
Title: Antenna and Package Design for 61- and 122-GHz Radar Sensors in Embedded Wafer-Level Ball Grid Array Technology
Language: English
Authors: Frank, Martin 
Reissland, Torsten 
Lurz, Fabian 
Voelkel, Matthias 
Lambrecht, Franziska 
Kiefl, Stefan 
Ghesquiere, Pol 
Jalli Ng, Herman 
Kissinger, Dietmar 
Weigel, Robert 
Kölpin, Alexander  
Keywords: Antenna arrays;embedded wafer-level ball grid array (eWLB);microwave sensors;millimeter-wave radar;packaging;radar systems
Issue Date: 1-Dec-2018
Source: IEEE Transactions on Microwave Theory and Techniques 12 (66): 8515104 (2018-12-01)
Journal or Series Name: IEEE transactions on microwave theory and techniques / Symposium issue 
Abstract (english): This paper suggests the usage of an optimized structure of the embedded wafer-level ball grid array technology for millimeter-wave antennas-in-package. Multiple antenna arrays in a second redistribution layer have been designed, evaluated, and integrated with different transceivers to form very compact sensor packages for 61- and 122-GHz radar applications. The resulting packages contain a complete radar front end while featuring dimensions of 8 mm × 8 mm. The packages are easy to assemble and replaceable. Theoretical considerations, numerical results, and measurements have been carried out for the single components. For the verification of the sensor packages, a system demonstrator was developed, and measurements have been performed in continuous-wave mode. At both frequencies, promising system performance regarding range and distance errors could be confirmed without the usage of complex processing and calibration algorithms.
ISSN: 0018-9480
Type: (wissenschaftlicher) Artikel
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