Evaluation of a microwave based contact-free testing method for mechanical sensitivity analysis of MEMS for inline integration of on-wafer measurements

Publikationstyp
Conference Paper
Date Issued
2013-10
Sprache
English
Author(s)
Oesterle, Florian  
Gardill, Markus  
Weigel, Robert  
Kölpin, Alexander  orcid-logo
TORE-URI
http://hdl.handle.net/11420/6787
Start Page
72
End Page
75
Article Number
06686593
Citation
European Microwave Conference (EuMC 2013)
Contribution to Conference
European Microwave Conference, EuMC 2013  
Scopus ID
2-s2.0-84893437718
Testing of Micro Electro Mechanical Systems is a key issue in high volume batch manufacturing. Deviating process parameters influence the nominal intrinsic stress level of the mechanical components, leading to a variation of the specified sensitivity, hence the system functionality. Focusing on a short test time, inline integration, and contactless excitation and analysis methods, establishing an electrical test for the required sensitivity within the mechanical domain is challenging. Depending on the design and functionality of the specific MEMS device, optical interferometry methods, Impedance or Network Analyzers or even final system level tests are implemented nowadays. This paper presents an alternative contactless testing method for sensitivity analysis of MEMS using microwave reflectometry. Proving the enormous potential of the method for inline integration, measurement results for varying chuck thickness and frequencies within the W-band are shown and evaluated, using a dedicated test setup for on-chip or on-wafer measurements.
Subjects
Contactless Testing
Deflection Measurement
Inline Integration
Mechanical Resonance
Mechanical Sensitivity
MEMS
Microphone
Microwave reflectometry
Pull-In
W-band