A Large deflection model of silicon membranes for testing intrinsic stress of MEMS microphones by measuring pull-in voltage

Mechanical parameters, especially mechanical stress of membranes used in silicon microphones strongly depend on the manufacturing process. As a result, deviations during this process can result in sensitivity variations of the microphone. Therefore, the stress should be well controlled within a certain tensile level. This paper describes a method to test devices electrically using the MEMS related pull-in phenomenon with respect to the mechanical compliance of microphone membranes. Using this method, out of specification chips can be detected at an early stage within the manufacturing process instead of determination at a system functionality test after packaging. Therefore, the adequacy for the intended use of the pull-in voltage and its dependency on varying tensile stress due to manufacturing tolerance is evaluated.

Subjects

Circular diaphragm

Inertial tensile stress

Large deflection

MEMS

Pull-in

Silicon microphone

Test

DDC Class

600: Technology

Options

A Large deflection model of silicon membranes for testing intrinsic stress of MEMS microphones by measuring pull-in voltage