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  4. A vertical interconnect with DC-block using a low-cost technology at mm-wave frequencies
 
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A vertical interconnect with DC-block using a low-cost technology at mm-wave frequencies

Publikationstyp
Conference Paper
Date Issued
2014-11
Sprache
English
Author(s)
Friesicke, Christian  
Rohrdantz, Benjamin  
Stark, Alexander  
Jacob, Arne  
Institut
Hochfrequenztechnik E-3  
TORE-URI
http://hdl.handle.net/11420/8346
Start Page
277
End Page
279
Article Number
7067995
Citation
Asia-Pacific Microwave Conference (APMC 2014)
Contribution to Conference
Asia-Pacific Microwave Conference, APMC 2014  
Scopus ID
2-s2.0-84949092571
A vertical interconnect for densely packed active antenna array front-ends between K- and V-band is studied in this paper. The interconnect provides DC-blocking, which is useful for hybrid integration of switched or active components within a vertical module stack. The DC-blocking functionality is implemented using the solder mask film commonly available in low-cost PCB fabrication processes. The design is robust against lateral misalignment and compatible with a wide range of solder mask dielectrics. The measured performance shows good matching between 20 GHz and 50 GHz, which makes the design attractive for current and emerging satellite communication bands.
Subjects
Active antennas
Hybrid integrated circuit interconnections
Satellite communication
Funding(s)
Hochintegrierte SANTANA-Antenne für mobile Applikationen  
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