1. TUHH Open Research (TORE)

IEEE transactions on components, packaging and manufacturing technology

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Journal

Name
IEEE transactions on components, packaging and manufacturing technology
 
JCR Abbreviation
IEEE T COMP PACK MAN
 
Alternative title(s)
Components, packaging and manufacturing technology
 
ISSN
2156-3950
2156-3985
 
Publisher
IEEE
 
ZDB-ID
 
Type
Journal
 

Articles in this Journal

Results 1-10 of 10

Issue DateVolume numberTitleAuthor(s)
1Feb-2022Multiconductor Transmission Lines for Orbital Angular Momentum (OAM) Communication LinksWulff, Michael ; Hillebrecht, Til ; Wang, Lei ; Yang, Cheng ; Schuster, Christian 
2Apr-2021Vertical Integration of Passive Microwave Components Using Functional Via Structures in LTCC Multilayer SubstratesYildiz, Ömer Faruk ; Thomsen, Ole ; Bochard, Marc ; Yang, Cheng ; Schuster, Christian 
31-Mar-2021A multistage adaptive sampling scheme for passivity characterization of large-scale macromodelsDe Stefano, Marco ; Grivet-Talocia, Stefano ; Wendt, Torben ; Yang, Cheng ; Schuster, Christian 
428-Sep-2017Efficient prediction of equalization effort and channel performance for PCB-based data linksReuschel, Torsten ; Preibisch, Jan ; Scharff, Katharina ; Rimolo-Donadio, Renato ; Duan, Xiaomin ; Kwark, Young Hoon ; Schuster, Christian 
51-Dec-2016Efficient total crosstalk analysis of large via arrays in silicon interposersDahl, David ; Reuschel, Torsten ; Preibisch, Jan ; Duan, Xiaomin ; Ndip, Ivan N. ; Lang, Klaus-Dieter ; Schuster, Christian 
625-Nov-2015A rigorous approach for the modeling of through-silicon-via pairs using multipole expansionsDuan, Xiaomin ; Dahl, David ; Ndip, Ivan N. ; Lang, Klaus-Dieter ; Schuster, Christian 
717-Nov-2015Efficient computation of localized fields for through silicon via modeling up to 500 GHzDahl, David ; Duan, Xiaomin ; Ndip, Ivan N. ; Lang, Klaus-Dieter ; Schuster, Christian 
830-Oct-2013Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technologyGu, Xiaoxiong ; Silberman, Joel A. ; Young, Albert M. ; Jenkins, Keith A. ; Dang, Bing ; Liu, Yong ; Duan, Xiaomin ; Gordin, Rachel ; Shlafman, Shlomo ; Goren, David 
919-Jun-2013Efficient DC analysis of power planes using contour integral method with circular elementsDuan, Xiaomin ; Brüns, Heinz-Dietrich ; Schuster, Christian 
10Mar-2013Complete modeling of large via constellations in multilayer printed circuit boardsMüller, Sebastian ; Happ, Fabian ; Duan, Xiaomin ; Rimolo-Donadio, Renato ; Brüns, Heinz-Dietrich ; Schuster, Christian