Entwicklung, Validation und Anwendung von semianalytischen Interconnect Modellen für die effiziente Simulation von Multilagensubstraten

Project Title
Development, Validation and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
Principal Investigator
Project Abstract
This project deals with the efficient modeling and simulation of multilayer substrates in high-speed electronic systems.
Semi-analytical models for vias and traces in packages and printed circuit boards are proposed and incorporated into a framework for automatic simulation of multilayer structures. The models are validated with general-purpose numerical methods for electromagnetic simulation and measurements, using typical configurations such as differential and single-ended links. Application scenarios of realistic complexity for signal integrity, power integrity, and electromagnetic compatibility are evaluated and the co-simulation of these three domains is explored.

TUHH Universitätsbibliothek. TUBDok Link: http://doku.b.tu-harburg.de/volltexte/2011/1091