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    SPP 2305: Microelectronic modular system for sensor-integrating machine elements
    The systematic development of sensor-integrating machine elements (SiME), in particular taking into account the severely limited installation space, efficient data management and a self-sufficient energy budget, represents a significant challenge in the field of mechatronic development that is currently not sufficiently supported methodologically. The aim of this project is to design and test a model-based microelectronic modular system for the systematic development of sensor systems in SiME, using the example of fixing and motion screws, in order to be able to configure and predefine application-specific sensor systems from electronic modules. This is to be achieved through the necessary collaboration between the different areas of mechanics, (micro-) electronics, software and design methodology.At the beginning, mechanical, electrical and geometrical requirements for sensor systems in sensor-integrating fixing and motion screws are identified. These are implemented in a requirements model in the modelling language SysML as the basis for the model-based microelectronic modular system. Subsequently, the product characteristics necessary to fulfil the requirements are determined. Available microelectronic components are subsequently identified, analysed with regard to their properties and a suitable structure for their classification is developed. The components are modelled in SysML with the associated dependencies and the necessary parameters for configuration and predesign as a microelectronic modular system. This type of modelling makes it possible to store different types of data elements and allows a simple consistency check in the case of later adjustments as well as the extension of the microelectronic modular system. If the modular structure is transferred to a suitable configuration system, it allows the application-specific combination of module variants and the configuration of different solution alternatives for sensor systems in SiME. This is done taking into account the respective requirements from the measurement task and the individual application and boundary conditions of the machine element. The system configuration and design is based on three newly defined basic strategies: optimised for data-, energy- or installation space. Two sensor systems are selected as examples for prototypical implementation in the form of demonstrators. For an initial verification of the model based modular system and the configuration system, the prototypically realised sensor system demonstrators will each be integrated into a fixing and a motion screw. Finally, the realised SiME prototypes will be experimentally examined in static and dynamic tests to enable a comparison between the measured and predicted signals and application limits of the sensor systems.
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    Hermetically sealed coatings for neural implants
    Neural implants are a promising approach towards sustainable treatment of a number of severe illnesses which cannot be healed today, such as blindness, Parkinson’s disease or the locked-in syndrome. These systems consist of very thin and flexible foils of insulating and conducting layers, which must be chronically implanted. They have to work 20 years and more in the brain. This needs a stability of hermetic sealing which cannot be provided by today’s micro technology.The project aims at finding a thin film package and a technology which provide reliable operation for 20 years in the brains liquor. The applicants propose to investigate sandwich layers from polymers and oxidic interlayers. As polymers, Parylene and Polyimide will be investigated. The interlayers will be metallic oxides, made by atomic layer deposition. Also systems with full hermetic sealing for each electric interconnect separately will be prepared and analyzed. The innovation is first the development, analysis and the improvement of a new concept for hermetically sealing neural implants. Second, innovation is a new process flow to deposit anorganic-organic barriers on flexible substrates in an isotropic and flawless way. The scientific method chosen is first to develop test procedures, next to prepare a series of samples and to analyze them. The primary test procedure will be the accelerated soak test, which means immersing the probes in hot saline and measuring them by dielectric spectroscopy. Samples with different topographies are prepared. These are coated with different barrier layers, then analyzed and evaluated. For one or several selected barrier coatings a full system will be assembled and tested.Theoretical description of the water diffusion will be made by a model based on activation energies. Since corrosion happens if liquid water is present, the condensation of the diffused water molecules at the boundary of polymer and metal oxide layers at micro cavities will also be modelled.
      189
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    Hamburg Electronics Lab for Integration of Optoelectronical Systems
    ForLab HELIOS is one of twelve Research Centers Microelectronics Germany (ForLab), funded by BMBF addressing the development of future electronics. A modern research infrastructure in collaboration between TUHH and CHyN at UHH is established for the co integration of photonics and microelectronics with 5.2 M€ investment in innovative equipement.
      113
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    prot.PSI - protein Pressure Specific Activity Impact
    Pressure is an essential parameter in chemical process engineering. In this project research is performed on the activity of enzymes under varying pressure conditions (from ambient pressure to beyond 1000 bar). The task of the Institute of Microsystems Technology is the implementation of an online analytics with minimum sample extraction from a high pressure reactor. For this purpose a micro valve and a micro flame ionization detector (µFID) will be developed.
      130