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Item type:Publication, Access status: without files , Multilayer capacitors with reduced parasiticsThis paper presents multilayer integrated capacitors. Stacked parallel plate and via topologies are discussed. A novel structure featuring both RF-blocking capabilities and reduced parasitic inductance effects is proposed. Reduced parasitics increase the self resonance frequency of the structure and make it applicable to highly integrated multichip modules up to millimeter-wave frequencies. Analytical and experimental results fully validate this approach.Publicationtype: Conference Paper29 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , A novel package approach for multichip modules based on anisotropic conductive adhesivesIn this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabilities is presented.Publicationtype: Conference Paper31