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Item type:Publication, Access status: without files , Analysis of Differential Crosstalk and Transmission for Via Arrays in Low Temperature Cofired Ceramics(2021-05); ; ; ; Given the ubiquitous use of via arrays in multilayer substrates based on organic materials, this work explores ceramic-based solutions instead. Assuming typical design and technology constraints, the performance of via arrays on low temperature cofired ceramics is studied in terms of crosstalk as well as transmission. Both single-ended and differential signaling are considered, thus covering a broad range of use cases for microwave applications and high-speed digital links. By employing single vias optimized with respect to 50O systems as fundamental building blocks for larger via arrays, different array configurations are proposed and analyzed. The question as to what moving from organic to ceramic materials and vice versa implies in terms of electrical performance is investigated. The majority of the work is based on the computationally efficient physics-based via modeling technique due to the size and complexity of the via array models, but comparisons to conventional full-wave solvers show strong agreement between the two methods up to 50GHz.Publicationtype: Conference Paper32 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently(2021-02-11); ; ; ; Low temperature cofired ceramics (LTCCs) refer to a mature technology with low-loss dielectric materials, high quality conductors, and high dimensional accuracy. This class of ceramics-based substrates is a popular choice for integration of a variety of electronics with active and passive components in both single- and multilayered environments. Vertical interconnect accesses (vias) are widely used in LTCC and elsewhere for signal routing as well as power and ground supply within the stack-up. Since vias represent discontinuities in the signal path, they introduce parasitic elements that inevitably degrade the electrical performance. This work intends to delineate two distinct, straightforward, and efficient ways to estimate as well as control via impedance and phase delay. The usability of vias in LTCC is extended through the concept of functional via structures, which is based on the generalization of vias as quasi-coaxial lines that behave similarly to real transmission lines. The advantage of the proposed concept is highlighted by deploying vias for three-dimensional (3-D) integration of power dividers, and improving the signal integrity (SI) and power integrity (PI) of via arrays in LTCC multilayered substrates.Publicationtype: Journal Article21