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Item type:Publication, Access status: without files , Understanding the copper underpotential deposition process at strained gold surfaceCopper underpotential deposition (UPD) on a gold surface is investigated by cyclic voltammetry coupled with in situ cyclic strain to understand the strain-modulated electrodeposition. Our work emphasizes quantification of an electrocapillary coupling coefficient ς, which relates the response of Cu electrodeposition potential, E, to applied strain, ε. The different responses to the strain are observed at two Cu UPD stages. The data indicate that tensile strain could enhance the formation of a Cu monolayer on the Au surface. The typical electrodeposition process could be modulated by an external mechanical strain.Publicationtype: Journal Article98 - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Access status: without files , The effect of surface strain on the CO-poisoned surface of Pt electrode for hydrogen adsorptionThe impact of mechanical strain is studied at CO-poisoned Pt(1 1 1) surface for hydrogen adsorption. Our experiment first investigates a coupling parameter of interest, ζH, which quantifies the variation of hydrogen adsorption potential in response to surface strain. The result exhibits a bigger ζH at CO-poisoned surface than the value measured at clean surface. Since adsorption potential is linked to adsorption energy, it indicates significantly the larger effect of tensile strain on decreasing hydrogen adsorption energy at CO-poisoned surface, comparing to the clean surface. DFT calculations at an atomic level support the experimental observation and explain this behavior can be attributed to the strain-induced reduction in CO-poisoning effect on hydrogen adsorption energy.Publicationtype: Journal Article95